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VIPS 2010 - Workshop on Vertically Integrated Pixel Sensors
22-24 April 2010 Collegio Riboldi Auditorium, Chiesa dei Santi Giacomo e Filippo
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Thursday, 22 April 2010
     Conference break -    Conference contribution -    Session: 3D activities in the microelectronic industry and application perspectives -    Session: 3D activities in the microelectronic industry and application perspectives
14:00
[34] Can 3D chip technology become the next growth engine for system performance improvement ?
by Dr. Aldo LOSAVIO (NUMONYX)
(14:00 - 14:40)
slides slides
[15] Parallel architecture processes for mems, memories, image sensors and other 3D systems
by Dr. Ubaldo MASTROMATTEO (STMicroelectronics)
(14:40 - 15:20)
slides slides
15:00
[46] SOI pixel detector with micro-bumps
by Makoto MOTOYOSHI (T-Micro)
(15:20 - 16:00)
slides slides
16:00 Coffee break
(16:00 - 16:30)
[37] 3D integrated pixel sensors: a technology development enabling smart imaging systems
by Dr. Piet DE MOOR (IMEC)
(16:30 - 17:15)
slides slides
17:00
[21] 3D Interconnect Technologies at CEA-Leti Minatec
by Mrs. Lea DI CIOCCIO (CEA-LETI Minatec)
(17:15 - 18:00)
slides slides
19:00
Welcome cocktail
(Pavia City Hall: 19:30 - 22:00)
20:00
21:00

Friday, 23 April 2010
     Conference break -    Conference contribution -    Session: Activities in the 3DIC Consortium -    Session: Activities in the 3DIC Consortium -    Session: R&D activities in Europe -    Session: R&D activities in Europe
09:00
[38] 3D technologies and intelligent trackers: summary of the WIT 2010 workshop
by Marcel DEMARTEAU (FNAL)
(09:00 - 09:30)
slides slides
[13] Vertical interconnection of pixel and FE electronics with the IZM SLID process
by Dr. Hans-Günther MOSER (MPI für Physik)
(09:30 - 10:00)
slides slides
10:00
[33] 3D Wafer Level packaging
by Oswin EHRMANN (Fraunhofer IZM)
(10:00 - 10:30)
slides slides
Coffee break
(10:30 - 11:00)
11:00
[32] The PANDA MicroVertex Detector: Present Design and Opportunities for 3D Integration Technologies.
by Dr. Angelo RIVETTI (INFN-Sezione di Torino)
(11:00 - 11:25)
slides slides
[29] Requirements for a 3D-integrated vertex detector at the Compressed Baryonic Matter - Experiment
by Dr. M. DEVEAUX (Goethe University Frankfurt/M)
(11:25 - 11:50)
slides slides
[39] 3D integration activities at CERN
by Dr. Sami VäHäNEN (CERN)
(11:50 - 12:15)
slides slides
12:00
[22] Ideas to exploit 3D fabrication processes and Geiger-mode avalanche photo diodes (GAPDs) in pixel tracking detectors for future linear colliders
by Dr. Angel DIEGUEZ (University of Barcelona)
(12:15 - 12:30)
slides slides
[24] CMOS Pixel Sensors on high-resistivity substrate: process availability and the first experimental results
by Dr. Wojciech DULINSKI (IPHC)
(12:30 - 12:50)
slides slides
Lunch
(12:50 - 14:30)
13:00
14:00
15:00
[19] 3D Activities at Fermilab and Developments Within the 3DIC Consortium
by Mr. Raymond YAREMA (Fermilab)
(15:00 - 15:30)
slides slides
[27] Front-end electronics for 3D technologies
by Dr. Grzegorz DEPTUCH (FNAL)
(15:30 - 16:00)
slides slides
16:00
[11] A Vertically Integrated Module Design for Track Triggers at Super-LHC
by Dr. Ronald LIPTON (Fermilab)
(16:00 - 16:20)
slides slides
Coffee break
(16:20 - 16:50)
[41] Pixel Sensors with Vertical Integration Technologies for the SuperB Silicon Vertex Tracker
by Dr. Giuliana RIZZO (Università di Pisa and INFN)
(16:50 - 17:10)
slides slides
17:00
[40] From 2D to 3D MAPS
by Dr. Mark WINTER (IPHC)
(17:10 - 17:40)
slides slides
[28] 3D electronic for SLHC pixels
by Mr. Jean-Claude CLEMENS (CPPM)
(17:40 - 18:10)
slides slides
18:00
[16] 3D deep N-well MAPS
by Lodovico RATTI (University of Pavia and INFN)
(18:10 - 18:30)
slides slides
20:00 Social dinner
(20:00 - 23:00)
21:00
22:00

Saturday, 24 April 2010
     Conference break -    Conference contribution -    Session: Latest developments involving vertical integration processes, 3D electronics, mechanics, optics, interposers -    Session: 3D activity in SOI technology -    Session: Concluding remarks -    Session: 3D activity in SOI technology -    Session: Latest developments involving vertical integration processes, 3D electronics, mechanics, optics, interposers
09:00
[42] Activities of the SOI R&D collaboration
by Dr. Yasuo ARAI (KEK)
(09:00 - 09:30)
slides slides
[43] Review of FD-SOI Technology and its Application to X-ray Pixel Sensors
by Dr. Ikuo KURACHI (OKI)
(09:30 - 10:00)
slides slides
10:00
[23] Frontend electronics in SOI
by Ms. Farah KHALID (Fermi National accelerator Laboratory)
(10:00 - 10:30)
slides slides
Coffee break
(10:30 - 11:00)
11:00
[44] Development of SOI pixel detectors
by Dr. Toshinobu MIYOSHI (KEK)
(11:00 - 11:30)
slides slides
[17] LBL SOI sensors
by Serena MATTIAZZO (University of Padova & INFN Sezione di Padova, I-35131 Padova (Italy))
(11:30 - 12:00)
slides slides
12:00
[35] RIKEN SOI detector for X-ray Free-Electron Laser Experiments
by Dr. Takaki HATSUI (RIKEN)
(12:00 - 12:30)
slides slides
Lunch
(12:30 - 14:00)
13:00
14:00
[30] A Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS pixels
by Mr. Patrick PANGAUD (CPPM/IN2P3/CNRS)
(14:00 - 14:20)
slides slides
[31] Pixel sensors using SOI technology at Fermilab
by Dr. Marcel TRIMPL (Fermilab)
(14:20 - 14:40)
slides slides
[20] VISCUBE: a heterogeneous multi-layer cellular sensor processor array
by Dr. Akos ZARANDY (MTA-SZTAKI)
(14:40 - 15:00)
slides slides
15:00
[45] The development of INMAPS in RAL
by Gary ZHANG (RAL)
(15:00 - 15:20)
slides slides
[25] Power Dissipation Optimization Attempt for Three Different 3D MAPS Structures
by Dr. Mariusz JANKOWSKI (IPHC)
(15:20 - 15:40)
slides slides
Coffee break
(15:40 - 16:10)
16:00
[26] A vertically integrated 3D CMOS Monolithic Active Pixel Sensors with fast digital readout
by Mr. Yunan FU (DRS-IPHC, University of Strasbourg, CRNS-IN2P3)
(16:10 - 16:30)
slides slides
[18] Design of a Monolithic Momentum Detector using a 3D IC Vertical Integration Approach
by Dr. Alessandro MARRAS (INFN Perugia)
(16:30 - 16:50)
slides slides
[14] Sparsified Fast Readout for a 256-Pixel 3D Device
by Dr. Alessandro GABRIELLI (INFN & Physics Dep. University of Bologna)
(16:50 - 17:10)
slides slides
17:00
[47] Concluding remarks
(17:10 - 17:30)
slides slides




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